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| (R) STPS3045G POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS s 30 A 45 V 175C 0.63 V K s s s s s VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING LOW THERMAL RESISTANCE HIGH DISSIPATION MINIATURE PACKAGE AVALANCHE CAPABILITY SPECIFIED A A D2PAK DESCRIPTION Single Schottky rectifier suited for switchmode power supply and high frequency DC to DC converters. Packaged in D2PAK surface mount package , this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt *: RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non Repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature* Critical rate of rise of reverse voltage Tc = 150C = 0.5 tp = 10 ms Sinusoidal tp = 2 s F = 1kHz square tp = 100 s square tp = 1s Tj = 25C Parameter Repetitive peak reverse voltage Value 45 50 30 200 1 3 6000 - 65 to + 175 175 10000 Unit V A A A A A W C C V/s dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/5 July 2003 - Ed: 5A STPS3045G THERMAL RESISTANCES Symbol Rth (j-c) Junction to case Parameter Value 1 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * VF ** Parameter Reverse leakage current Forward voltage drop Tests Conditions Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 5 ms, < 2 % ** tp = 380 s, < 2% Min. Typ. 20 Max. 500 80 0.63 0.84 0.78 Unit A mA V VR = VRRM IF = 30 A IF = 60 A IF = 60 A 0.68 0.53 To evaluate the conduction losses use the following equation : P = 0.48 x IF(AV) + 0.005 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 25 20 15 10 T Fig. 2: Average forward current versus ambient temperature (=0.5). IF(av)(A) = 0.1 = 0.05 = 0.2 = 0.5 =1 35 Rth(j-a)=Rth(j-c) 30 25 20 15 10 5 tp Rth(j-a)=30C/W T 5 IF(av) (A) 0 0 5 10 15 20 25 =tp/T =tp/T tp Tamb(C) 0 25 50 75 100 125 150 175 30 35 40 0 Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 2/5 STPS3045G Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. IM(A) 400 350 300 250 200 150 100 50 0 1E-3 Tc=125C IM t Zth(j-c)/Rth(j-c) 1.0 0.8 Tc=75C Tc=100C 0.6 0.4 0.2 = 0.5 = 0.2 = 0.1 T =0.5 t(s) 1E-2 1E-1 1E+0 0.0 1E-4 Single pulse tp(s) 1E-3 1E-2 =tp/T tp 1E-1 1E+0 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values) Fig. 8: Junction capacitance versus reverse voltage applied (typical values). IR(A) 1E+5 Tj=150C C(nF) 5.0 F=1MHz Tj=25C Tj=125C Tj=100C 1E+4 1E+3 1E+2 1E+1 1E+0 0 5 10 15 Tj=75C 1.0 Tj=50C Tj=25C VR(V) 20 25 30 35 40 45 VR(V) 0.1 1 2 5 10 20 50 Fig. 9: Forward voltage drop versus forward current (maximum values). Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35m) IFM(A) 200 100 Typical values Tj=125C Tj=25C Rth(j-a) (C/W) 80 70 60 50 40 10 Tj=125C 30 20 10 0 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 S(Cu) (cm) 0 2 4 6 8 10 12 14 16 18 20 3/5 STPS3045G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E L2 C2 Millimeters Min. Max. 4.40 4.60 2.49 2.69 0.03 0.23 0.70 0.93 1.14 1.70 0.45 0.60 1.23 1.36 8.95 9.35 10.00 10.40 4.88 5.28 15.00 15.85 1.27 1.40 1.40 1.75 2.40 3.20 0.40 typ. 0 8 Inches Min. Max. 0.173 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.045 0.067 0.017 0.024 0.048 0.054 0.352 0.368 0.393 0.409 0.192 0.208 0.590 0.624 0.050 0.055 0.055 0.069 0.094 0.126 0.016 typ. 0 8 D L L3 A1 B2 B G A2 C R M * V2 * FLAT ZONE NO LESS THAN 2mm A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 FOOTPRINT DIMENSIONS (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 4/5 STPS3045G Type STPS3045G STPS3045G-TR s Marking STPS3045G STPS3045G Package D2PAK D2PAK Weight 1.48g 1.48g Base qty 50 500 Delivery mode Tube Tape & Reel Epoxy meets UL94, V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5 |
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